|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Recent Advancement on Stretchable and Wearable Electronics
||A New Architecture for Flexible Large-area Electronic Systems
||Sigurd Wagner, Warren Rieutort-Louis, Josue Sanz-Robinson, Tiffany Moy, Liechao Huang, Yingzhe Hu, Yasmin Afsar, James C Sturm, Naveen Verma
|On-Site Speaker (Planned)
We describe a new approach to the architecture, design and fabrication of flexible large-area electronic systems that addresses two well-known challenges: (i) although only thin-film electronics can cover large areas, it lacks the speed needed for computation and communication; and (ii) a multitude of sensor applications, drawing from many diverse technologies, are difficult to integrate monolithically. We solve these challenges by (i) introducing hybrid systems that couple thin-film electronics with CMOS; and (ii) integrating diverse subsystem sheets by lamination. Interconnects are made by inductive or capacitive coupling, instead of via-type metallurgy. The large surfaces that are available offer the freedom of designing inductors and capacitors for optimal circuit performance. Sheet-to-sheet alignment is easy because the inductances and capacitances are robust against misalignment and variations of adhesive thickness. After reviewing the basic system architecture to highlight the CMOS/large-area interfaces, we discuss the performance of their inductive and capacitive contacts.
||Planned: TMS Journal: Journal of Electronic Materials