|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Subgrain Rotation Behavior of SnAgCu-SnPb Mixed Solder Joints in BGA Components during Thermal Shock
||Fu Guo, Shihai Tan, Jing Han
|On-Site Speaker (Planned)
BGA samples with Sn3.0Ag0.5Cu solder joints were soldered on the Printed Circuit Board with the eutectic SnPb solder paste to form mixed solder joints. Then BGA samples were cross-sectioned prior to thermal shock to obtain the grain orientation of the initial state by using the Scanning Electron Microscope equipped with Electron Backscattered Diffraction system. Therefore, in this paper, several mixed solder joints which had different angles between the c axis of Sn crystal and chip at the corner of the BGA package were selected to investigate the subgrain rotation behavior of mixed solder joints during thermal shock. And the solder joints which were selected in this paper were single-crystal solder joints and had the similar position. The results showed that the subgrain rotation behavior were variable among the mixed solder joints with different angles between c axis of Sn crystal and chip.
||Planned: Supplemental Proceedings volume