|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVI
||L-177: Calorimetric Investigation of the Liquid Sn-3.8Ag-0.7Cu Alloy with Minor Additions of Mn and Ni
||Andriy Yakymovych, Hans Flandorfer, Herbert Ipser
|On-Site Speaker (Planned)
To date, additions of pure metals, such as Co, Mn or Ni, in bulk and nanosized forms is one of the most widespread procedures to reinforce the microstructure and improve the mechanical properties of Sn-based Sn-Ag-Cu solder alloys. However, the scientific activity related to the development of novel lead-free solders should not be limited to studies of mechanical properties only. For instance, solidification behavior, interfacial diffusion and reaction as well as microstructure of multi-component alloy systems can be estimated from a proper thermodynamic and kinetic data base. This research deals with the heat effects observed on mixing of Mn and Ni with liquid Sn-3.8Ag-0.7Cu alloy using drop calorimetry. From this the integral and partial enthalpies of mixing for the quaternary (Sn-3.8Ag-0.7Cu)-Mn and (Sn-3.8Ag-0.7Cu)-Ni alloys are estimated. The microstructure and phase composition of furnace cooled samples after calorimetric runs were examined using SEM and X-ray diffraction.
||Planned: Supplemental Proceedings volume