|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Deformation and Transitions at Interfaces
||The Role of Interfaces in Nucleation of Dynamic Damage in FCC and BCC Materials
||Saryu Fensin, Eric Hahn, Tim Germann, Ellen Cerreta, George Gray
|On-Site Speaker (Planned)
For ductile metals, the process of dynamic fracture occurs through nucleation, growth and coalescence of voids. For high purity metals, it has been observed that voids tend to heterogeneously nucleate at grain boundaries and all grain boundaries are not equally susceptible to void nucleation. Several factors can affect the failure stress of a grain boundary, such as structure, energy and excess volume, in addition to its interactions with dislocations. Flyer plate simulations were carried out for four boundary types with different energies and excess volumes in both materials. These boundaries were chosen as model systems to represent various boundaries observed in “real” materials. In this work, we will compare the mechanisms behind void nucleation in FCC (Cu) and BCC (Ta) materials by using molecular-dynamics simulations. We will also explore the influence of grain boundary energy, excess volume and plasticity at the boundary on the failure stress of a grain boundary.