|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVI
||Formation and Growth of Intermetallic Compound Layer at the Lead-free Solder/Cu Interface Using Laser Soldering Process
||Hiroshi Nishikawa, Noriya Iwata, Shinya Kubota
|On-Site Speaker (Planned)
With the miniaturization of electronic productions and the use of heat sensitive electronic components, a traditional reflow soldering using a furnace often has difficulties. As an alternative soldering process, a laser soldering process has been recently proposed. The laser soldering process brings several advantages in terms of localized heating, and rapid rise and fall in temperature. In this study, the formation and growth of an intermetallic compound (IMC) at the lead-free solder/Cu interface were investigated to clarify the characteristics of the laser soldering process. The results show that the rapid rise and fall in temperature strongly affected the IMC formation at the interface and the IMC thickness for the laser soldering was thinner than that for the traditional reflow soldering. During isothermal aging, the growth rate of IMC layer at the interface for the laser soldering was faster than that for the traditional soldering.
||Planned: Supplemental Proceedings volume