|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||2016 Technical Division Student Poster Competition
||SPG-10: Comparison on Electrochemical Migration Behavior of Fine-pitch Ag Interconnects Prepared by Screen Printing and Lithography Methods
||Chia-Hung Tsou, Heng-Tien Lin, Fan-Yi Ouyang
|On-Site Speaker (Planned)
Usage of fine-pitch interconnect became mainstream in high performance electronic devices. Electrochemical migration (ECM) would be a serious problem in fine-pitch scale interconnects under temperature, humidity and biased voltage. In this study, fine-pitch Ag interconnects prepared by screen printing and lithography methods were investigated by water drop (WD) test through in-situ voltage versus time (VVT) curve to observe the difference in their ECM behavior according to different pitch sizes (20 um to 50 um) and different electrolytes (deionized water and NaCl solution). The results show that different failure modes were found resulting from different electrolytes and processing methods. The ECM performance of WD tests on Ag interconnects with different manufacturing process and electrolytes would be compared and corresponding failure mechanism would be discussed.
||Definite: None Selected