|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||The Microstructure and Hot Rolling Deformation Mechanism of AuSn Eutectic Alloy
||Yong Mao, Jiyang Xie, Yanan Du, Kai Xiong
|On-Site Speaker (Planned)
AuSn eutectic alloy as a Pb-free solder is extensively used in high performance optoelectronics and power electronics packaging due to its high strength, high electrical and thermal conductivity, and good creep resistance. Hot rolling and/or room temperature rolling are usually preferred methods to prepare AuSn alloy solder foils. However, very little work was focus on microstructures and hot deformation mechanisms. In this work, the microstructures of AuSn eutectic alloy in the as-cast and hot-rolled condition were investigated by transmission electron microscopy (TEM). Grain size, dislocations, stacking faults, twins and other microstructures and potential mechanisms underlying were discussed before and after the hot rolling deformation. This investigation of microstructure and hot deformation mechanism of AuSn eutectic alloy may shed light on the design of intermetallic compound with workability.
||Planned: Supplemental Proceedings volume