| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Mechanism of Microstructure Evolution and Fatigue Failure in Lead Free Solder Joint |
| Author(s) |
Jeong Min Kim, Woong Ho Bang, Choong-Un Kim, Tae-Kyu Lee, Hongtao Ma, Kuo-Chuan Liu |
| On-Site Speaker (Planned) |
Choong-Un Kim |
| Abstract Scope |
There have been extensive studies on the microstructural characteristics on the solder joint and their evolution with thermal history. Such studies are motivated by anticipation that fracture reliability is keenly affected by solder joint microstructure, and in fact identifies several potential contributing factors including Sn phase texture, grain size, IMC thickness, its morphology and interface composition. However, the exact mechanism by which such factors become influential to fracture reliability is not well understood. Spurred by this, we have conducted series of experiments that 1) track the microstructural evolution of lead-free solder joint with aging and 2) correlate the result to fracture reliability by conducting cyclic fatigue testing. This paper discusses the major findings of our research and shows 1) fracture resistance and even fracture location changes greatly with aging and 2) such change can only be explained by consideration on changes in mechanical constraints collectively induced by all contributing factors. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |