|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVI
||Solderability of Ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu Pad: P Content Effect of the Pd(P) Film
||Ying-Syuan Wu, Pei-Tzu Lee, Ming-Kai Lu, Tsai-Tung Kuo, Cheng-En Ho
|On-Site Speaker (Planned)
Recently, a great deal of attention has been focused on an ultrathin Ni(P) surface finish (less than 0.3 μm in thickness) over the Cu pads because of its lower dB loss at high frequencies and better suitability of fine-pitch packaging applications than a thick Ni(P) film. The effect of Ni(P) thickness on the solderability has been recently investigated; however, information regarding the P content effect of the Pd(P) film is still seriously lacking to date. The focus of this study is to investigate the soldering reaction between a Sn-3Ag-0.5Cu alloy and an ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad, where the Pd(P) film possessed various P contents in the range of 0–4 wt.%. Additionally, the mechanical properties of Sn-3Ag-0.5Cu/Au/Pd(P)/Ni(P)/Cu were examined via a high-speed ball shear test. Optimization of the P content in the Pd(P) film for this ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad will be made in this study.
||Planned: Supplemental Proceedings volume