|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Powder Metallurgy of Light Metals
||Processing-Microstructure Relationships during Cold Spray Deposition of Aluminum-Copper Alloys
||Tian Liu, Luke Brewer, Jeremy Leazer, E.S.K. Menon, B.D. Bouffard, J.A. Christophersen, F.A. Lancaster, J.N. Wolk
|On-Site Speaker (Planned)
This work studied the processing-microstructure relationships during cold spray (CS) deposition of binary aluminum-copper alloys. Cold gas-dynamic spray deposition is a relatively new process that can create corrosion protection coatings and perform additive repair for aluminum structures. This work aimed to produce a series of Al-Cu alloy coatings, ranging from 2 to 5 weight percent copper, using low-pressure CS deposition with helium and air as the carrier gases. Microstructural evolution caused by the CS process was studied using SEM, EBSD, and TEM. The relationship between copper content and coating quality was systematically investigated by comparing coating thickness, porosity and hardness. Using helium gas, all of the alloys were successfully deposited as high density coatings with highly deformed microstructures. The copper content of the feedstock powder directly influenced the volume fraction of Al2Cu intermetallics and the coating hardness, while having no measurable effect on the critical velocity for deposition.
||Planned: EPD Congress Volume