| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Study of Joule Heating Effects in Lead-Free Solder Joints under Various Current Densities Using Infrared Thermography |
| Author(s) |
Guangchen Xu, Fu Guo, Andre Lee, K.N. Subramanian, Neil Wright |
| On-Site Speaker (Planned) |
Guangchen Xu |
| Abstract Scope |
Temperature distribution in the eutectic Sn-Bi solder joints that does not exhibit thin-thick divergence associated with current crowding issues was investigated using the non-contact infrared thermography technique. These studies evaluated the role of imposed current density and the associated increases in temperature at different regions of solder joint. Findings of this study indicate that the existing temperature differences between center and end region of these solder joints are based on thermal conductivity issues, in spite no having current crowding in the joint geometry employed. These differences arise based on the thermal conduction issues rather than current crowding issues. Implications of these findings on thermal migration, which is believed to be of importance in inter-connects will be discussed. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |