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Meeting 2016 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XV
Presentation Title Liquidus projection and thermoelectric property of (Cu,Ag)–Ga–Te Thermoelectric Materials
Author(s) Yen-Te Cho, Tzung-Jin Dung, Hsin-jay Wu
On-Site Speaker (Planned) Yen-Te Cho
Abstract Scope Thermoelectric materials converts waste heat into electricity directly and reversibly. The (Cu,Ag)-Ga-Te materials systems are promising thermoelectric systems, mainly due to the p-type chalcopyrite AgGaTe2 and CuGaTe2. The peak zT(figure-of-merit) value of AgGaTe2 is around 1.2 at the region of 600-800oC. Phase diagram provides materials’ fundamental information, and is important for understanding the phase relations and controlling the microstructures. However, for both the Ag-Ga-Te and Cu-Ga-Te systems, only limited information is available. This study is keen to determine the liquidus projections of Ag-Ga-Te and Cu-Ga-Te systems by experiments and the thermoelectric properties of selected (Cu,Ag)-Ga-Te alloys would be evaluated.
Proceedings Inclusion? Planned: A print-only volume

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A New Insight on the Electromigration Effect: Strain-induced Atomic Migration under Current Stressing
A Significant Improvement in the Electrocatalytic Stability of N-doped Graphene Nanosheets used as a Counter Electrode for Iodide/triiodide based Dye-sensitized solar cells and [Co(bpy)3]3+/2+ based Porphyrin-sensitized Solar Cells
Ab Initio Mechanistic Study on the Charging/Discharging Behaviors of the Layered-layered Lithium-rich Composite Cathode for Lithium-ion Batteries
An Experimental and Computational Approach to Properties of Mg2TiO4: Mn+4 Red Emitting Phosphor
Analysis for Formation of Kirkendall Voids during Solid-state Annealing in the Cu/Sn System
Calorimetric Investigation of the Liquid Sn-3.8Ag-0.7Cu Alloy with Minor Co Additions
Comparison of Electrotroless and Electroplating of Nickel Iron Alloy for the Diffusion Barrier of UBM
Contact-Resistance Reduction for Cu(Ti)/Conductive-Oxide-Film Junctions
Creep-induced Voiding in Sn phase of Pb-free Solder Joint
Development of High Strength and High Electrical Conductivity of Cu-Ni-Al Alloys
Dissolution Behavior of Ni Substrate and Ni3Sn4 Phase in Molten Lead-free Solders
Effect of Cu Surface Microstructure on Surface Oxidation and Soldering Wettability
Effects of Electroless Copper Bath Compositions on the Adhesion of Cu/Substrates in PCB
Effects of Electroplating Formula on the Void Formation at the Sn/Electroplated Cu Interface
Effects of Electromigration on the p-Bi2Te3/Sn Interfacial Reactions
Electrochemical Evaluation of Copper Etchant to Reduce the Galvanic Etching in Cu/Au Coupled Pads
Failure Mechanism of Cu6Sn5 Microbumps under Current Stressing
Formula Optimization of Titanium Dioxide Paste for Dye-sensitized Solar Cells
Interfacial Reactions between Tin and Ni-coated Bi2Te3
Interfacial Reactions in the Ni/Ag-Sb and Ni/Ag-Ge Couples
Investigation on the Phase Stability of Perovskite in La-Sr-Cr-Fe-O System and Its Long-term Operation
Kinetic Study of Silver Electrocrystallization on Silane-grafted Flexible Indium-oxide Substrate
Kinetics of Low-temperature Copper-Germanide Formation for Applications on Flexible Substrates
Liquidus projection and thermoelectric property of (Cu,Ag)–Ga–Te Thermoelectric Materials
Low-temperature Pressure-less Silver-to-silver Direct Bonding at Ambient Condition: Part I-Experimental Study
Low-temperature Pressure-less Silver-to-silver Direct Bonding at Ambient Condition: Part II-Mechanistic Study
Low Temperature Au to Au Direct Bonding by Highly <110>-oriented Au Films
Low Temperature Copper to Copper Direct Bonding with Different Thickness of (111) Nanotwinned Cu
Material Issues in Memristive Devices
Morphological Stability of Interfaces under Electromigration Condition: Insights from Phase-field Study
Phase Equilibria of the Sn-Fe-Ni Ternary System at 270oC
Phase Equilibria of Thermoelectric Ag-Bi-Se System
Probing Phase Transformations at the Nanoscales – Synchrotron X-ray Microdiffraction for Advanced Applications in Microelectronics, Phase-Change Memory and Solar PV Devices
Rapid Formation and Phase Transformation of Intermetallic Compounds Interconnection under Stress Current at Ambient Temperature
Stress and Currents Density Effects on Copper-Tin Intermetallic Compound Formation
Strong Inhibition of IMC Growth at the Sn/Co System by Minor Ga Addition
The Development of Alumina Nanofluid-based Electrolyte for Thermogalvanic Cells
The Kinetic Analysis of Co-Sn Binary System
Thermal Stabilities and Properties of AgBiS2 and AgBi3S5: a Review and Experimental Study
Tunable Surface Wettability and Adhesivity of Nitrogen-doped Graphene Foam
Using Sn-Bi Solder as the LED Die-attach Material by Controlling the Sn-Bi Composition and the Roughness of the Substrate

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