| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Characterization of Metal Whisker Growth in Sn-Based Solders |
| Author(s) |
Guangchen Xu, Dongyue Zhang, Hu Hao, Mengke Zhao, Yaowu Shi, Fu Guo |
| On-Site Speaker (Planned) |
Dongyue Zhang |
| Abstract Scope |
Metal whiskers are small crystals that grow from the surface of metals, resulting in reliability issues such as electrical short circuit or debris for equipment manufacturers and users. In order to reveal the basic mechanism for the growth of metal whiskers and evaluate its physical properties, accelerated test was employed by adding the rare earth elements into the Sn-based solder alloys. The ultimate results illustrate the rapid growth of metal whiskers with various morphologies at the surface of rare earth oxide phase. The correlation among ambient temperature, different rare earth additives, and isothermal aging time were achieved to quantify the unique morphology of metal whiskers. What’s more, focus ion beam (FIB) was assisted to analyze the fast diffusion channel at the root of metal whiskers. In addition, a preliminary attempt was carried out to investigate the capacity of carrying electric current by the metal whiskers. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |