|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Rare Metal Extraction & Processing
||FEM Simulation of Nodulation in Copper Electrorefining
||Ken Adachi, Yuya Nakai, Atsushi Kitada, Kazuhiro Fukami, Kuniaki Murase
|On-Site Speaker (Planned)
It has been reported that, in the copper electorefining process, the short circuit between the cathode and the anode caused by the nodulation has the largest impact on the loss of the current efficiency. In order to improve the current efficiency, it is important to reveal the mechanism of the growth of the nodule.
In this study, the nodulation is modeled by simulating numerically the growth of the copper stick attached on the cathode. Considering the pitch of the electrodes, the relation between the height of the nodule and its growth rate are investigated. In particular, the threshold height of the nodule which determines whether it will grow up to contact on the anode or not is focused. By comparing the result of the simulation and the experiment, the effect of leveling additives and the generation of dendritic growth are discussed.