| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Kinetics of Intermetallic Compound Formation at the Interface between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrate |
| Author(s) |
Youngmin Kim, Hee-Ra Roh, Young-Ho Kim |
| On-Site Speaker (Planned) |
Youngmin Kim |
| Abstract Scope |
The interfacial reaction and intermetallic compound (IMC) growth during aging at the Sn-3.5Ag-0.5Cu (SAC)/Cu-Zn interface were investigated. By dipping Cu or Cu-10Zn wires into the molten solder at 260℃, the scallop-shaped Cu<SUB>6</SUB>Sn<SUB>5</SUB> formed. Then, specimens were aged subsequently at 120℃, 150℃, and 180℃ up to 2000 h. The typical bi-layer of Cu<SUB>6</SUB>Sn<SUB>5</SUB> and Cu<SUB>3</SUB>Sn formed and numerous microvoids were found at the SAC/Cu interfaces, while no Cu<SUB>3</SUB>Sn and microvoids were observed at the SAC/Cu-Zn interfaces after aging. IMC growth was remarkably depressed on Cu-Zn substrates and this effect was more prominent at higher aging temperature. The parabolic behavior of IMC thickness versus aging time shows the IMC growth is controlled by diffusion. The activation energy for the IMC growth of SAC/Cu-Zn specimens was larger than that of SAC/Cu specimens. This research was supported by the Component Material Technology Development Program of the Ministry of Commerce, Industry, and Energy (MOCIE). |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |