|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XV
||Effects of Electroplating Formula on the Void Formation at the Sn/Electroplated Cu Interface
||Tai-Yi Yu, Chih-Ming Chen
|On-Site Speaker (Planned)
The reliability of solder joints is affected by the formation and growth of the Cu-Sn intermetallic compounds (IMCs) resulted from the solder/Cu interfacial reactions. Void formation accompanying the IMCs growth also significantly affects the reliability of solder joints. Kirkendall effect originated from inconsistent atomic interdiffusion is generally taken as the root cause for the void formation at the joint interfaces; however, some recent investigations imply that the additives in the electroplating solution also play an important role in the void formation. In this presentation, we will report the effects of electroplating formula, especially additives, on the void formation at the Sn/Cu interface under thermal aging. Different void formation phenomena were observed at the Sn/Cu interface when the solder joints were thermally aged at different temperatures. A possible mechanism will be discussed in the presentation.
||Planned: A print-only volume