|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||In-situ Evolution of the Nanoporous Microstructure of Sintered Ag at High Temperature
||Azdine Nait-Ali, Diouwel Tandiang, Marc Legros, Yijin Liu, Douglas Van Campen, Xavier Milhet
|On-Site Speaker (Planned)
Silver pastes sintering is a potential candidate for die bonding in power electronic modules. The joints, obtained by sintering, exhibit a significant pore fraction thus reducing the density of the material compared to bulk silver. This was shown to alter drastically the mechanical properties (Young's modulus, yield strength and ultimate tensile stress) at room temperature. However, while careful analysis of the nanoporous structure has been reported in 2D, little is known about its quantitative spatial evolution during thermal ageing and more specifically during temperature jumps. In this context, high temperature evolutions of the 3D nanoporous structure were observed in-situ using a heater fitted into the beamline 6-2C of SSRL. Segmentation of the porosity and subsequent statistical analysis of the tomographic dataset reveal pore shape, size and spatial distributions evolution during continuous heating. Such an analysis provides insight into the microstructural evolution of sintered nanoporous Ag joints in-service.
||Planned: Supplemental Proceedings volume