|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Nanoscale Soldering of Self-assembled Multi-segment Metallic Nanowires
||Jirui Wang, Fan Gao, Chefu Su, Junwei Su, Hongwei Sun, Zhiyong Gu
|On-Site Speaker (Planned)
Nanowires are promising building blocks for a variety of applications such as electronics, photonics, sensors/biosensors, as well as energy conversion and storage devices. However, joining and bonding of nanowires have been challenging issues. In this study, multi-segment nanowires with soldering elements were successfully synthesized through a template assisted electrodeposition method and applied for assembly and soldering. Multi-segment nanowires were achieved by changing the electrolyte in sequence, and the length of each segment was controlled by different electrodeposition current and time. 2D micro-patterns on Si/SiO2 substrate were fabricated by lithography, and the multi-segment nanowires with solder ends were connected into 2D or 3D structures by self-assembly method, such as magnetic field assisted assembly. After soldering these self-assembled nanowires, effective electrical and thermal connection can be achieved. These ordered 2D or 3D structures formed by self-assembly and nano-soldering can be used for various applications such as sensors/biosensors or phase change materials (PCMs).
||Planned: Supplemental Proceedings volume