|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XV
||Comparison of Electrotroless and Electroplating of Nickel Iron Alloy for the Diffusion Barrier of UBM
||Ja-Kyung Koo, Sung K. Kang, Jae-Ho Lee
|On-Site Speaker (Planned)
Electro and electroless nickel plating have been extensively used as a diffusion barrier in UBM (under-bump metallization) or a surface finish of printed circuit boards. Even though a thin Ni layer on top of Cu can reduce the interfacial reactions with Sn-rich solders at a low reflow temperature, it may not be so effective when a reflow process is performed at a higher temperature and for a longer period. To provide a more robust diffusion barrier layer than electroless Ni, electro and electroless Ni-Fe alloy system has been proposed. In this research, the electroless plating bath of Ni-Fe alloys was investigated. The Fe contents in electroplating bath were controlled and the compositions of electroplating layers were analyzed with EDS. The desired Ni-Fe alloys were obtained by controlling the chemical composition of the bath and its operating parameters. Interfacial reactions with Pb-free solders were also compared.
||Planned: A print-only volume