|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Nanoparticle-Reinforced Lead-free Solder Pastes for Electronics Assembly and Packaging
||Evan Wernicki, Fan Gao, Zhiyong Gu
|On-Site Speaker (Planned)
Components are often joined to PCBs via solder pastes, making them essential during manufacturing. Numerous reports have shown that inclusion of nanomaterials into bulk solders can increase the mechanical strength of solder systems. Here, preliminary results show small additions of nanomaterials to solder pastes can increase the mechanical strength of the reflowed material. Tin-based alloy nanoparticles, synthesized using a scaled-up chemical reduction method, were characterized by SEM and TEM. Nanoparticle structure and melting temperature were observed by XRD and DSC, respectively. Prepared nanoparticles used with lead-free microsolders formed the nanosolder-enabled pastes. Pastes of varying material ratios were screen printed with various parameters for evaluation. Samples were subsequently reflowed to observe solder paste performance. Shear strengths of the reflowed pastes were measured to study the effect of the nanoparticle additions. Melting behavior of the solder pastes were examined by DSC. Solder aging was also observed to investigate their associated IMC’s formed.
||Planned: A print-only volume