|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||A Study of Microstructure, Electronic Flame-off Characteristics and Electrical Properties of Au-coated Al-Zn Wires
||Keng-Yi Hsu, Fei-Yi Hung, Truan-Sheng Lui
|On-Site Speaker (Planned)
As the only material for wire bonding at first, Al had been replaced with Au since the unsolved problem, difficulty of forming a free air ball (FAB) with a perfectly round shape by electronic flame-off (EFO) because of the poor wettability of naturally-formed surficial alumina, could only be solved by using Au as the wire material then. However, in this study, round-shaped FABs of 1 mil Au-coated Al-Zn wires have been successfully produced with EFO process. Zinc is added by 3 wt.% for better wettability, and the Au coating further improves its wetting and inhabits the oxidation during EFO. The elemental distribution of the FABs and electrical properties of wire were investigated. The results show that with the Au coating, roundness of FABs are significantly improved. Accordingly, the wire does greatly expand the application of Al wire in wire bonding.
||Planned: Supplemental Proceedings volume