| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Critical Conditions of Electromigration-Induced Cu Dissolution in Pb-Free Solder Joints |
| Author(s) |
Jung Kyu Han, King-Ning Tu |
| On-Site Speaker (Planned) |
Jung Kyu Han |
| Abstract Scope |
One of the most serious reliability problems in solder joints technology still remains on current crowding region. In order to reduce current crowding effect, thick Cu under-bump-metallization (UBM) or Cu column structure has been investigated. If the thickness of Cu is not thick enough, it could not effectively eliminate current crowding. If Cu is too thick, however, it may cause the increase of thermal-mechanical stress. Therefore, kinetics under electromigration to study how fast Cu dissolves into the solder is of interest. The thickness of intermetallic compounds (IMC) shrinks first and reaches dynamic equilibrium. Once it reaches the dynamic equilibrium, Cu starts to dissolve into solder very fast. Experiment of several different conditions was carried out and the kinetic model is proposed to predict Cu dissolution rate at given temperature and current density. This study also shows critical conditions to stimulate fast Cu dissolution. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |