|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Microstructural Investigation on the Mechanism of Ag Thin Film Bonding
||Zhi-Quan Liu, Hao Zhang, Cai-Fu Li, Tohru Sugahara, Shijo Nagao, Katsuaki Suganuma
|On-Site Speaker (Planned)
Ag thin films are extensively used in modern electronics primarily because of their good properties. We had reported previously a novel phenomenon of Ag nano-volcanic eruption which based on sputtered Ag thin films, whose formation originates in, and is coupled with, Ag-O interactions. The mechanisms of abundant Ag hillock formation and pressure-less direct Ag-to-Ag bonding are explained by the Ag nano-volcanic eruption mechanism. It was believed that patterned Ag hillock arrays and direct Ag-to-Ag bonding can be formed by the homogenous crystallization of erupted Ag amorphous coatings, and highly hydrophobic surface which composed by Ag hillock arrays can be prepared by the controlled-growth of Ag hillock at a mild process conditions. In this study, the Ag thin film bonding microstructure was characterized and investigated precisely using transmission electron microscopy, in order to elaborate the Ag “nano-volcanic eruption” process as a new mechanism of hillock formation and bonding.
||Planned: Supplemental Proceedings volume