|About this Abstract
||2013 TMS Annual Meeting & Exhibition
||2013 and Beyond: Flexible Electronics
||Fabricating High-Strain Capacity Conductors on Shape Memory Polymers in Metastable States to Accommodate Large Shape Changes in Flexible Electronic Devices
||Abhishek Raj, Wenzhe Cao, Sigurd Wagner, Walter Voit
|On-Site Speaker (Planned)
Stretchable and flexible electronics have been proposed for multiple devices and sensing systems in which stiff silicon substrates are not practical. Instead, polymer substrates in these devices and systems can recover strains up to 800%, but typical conductors fail at strains well below 50%. This work demonstrates electrodes with improved strain capacity by pre-straining polyacrylate shape memory polymer (SMP) substrates at a temperature above their glass transition (Tg), cooling them to fix that temporary shape and then depositing electrodes. Alternatively, SMP substrates can be used as carriers to pre-strain other materials such as poly(dimethylsiloxane) (PDMS) before electrode deposition. SMPs are then heated above Tg to enable strain recovery while compressing and wrinkling gold electrodes. Induced morphology changes, illustrated by SEM and AFM, improve resistivity and enable higher strain electrodes for emerging stretchable and flexible electronic devices such as multi-electrode arrays, cortical brain probes and cochlear implants.