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Meeting Materials Science & Technology 2019
Symposium Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Presentation Title Understanding Reliability Failure Mechanisms in Pb Free Solder Joint with Micro-gap Configuration
Author(s) Choong-un Kim, Yi-Ram Kim, Hossein Madanipour
On-Site Speaker (Planned) Choong-un Kim
Abstract Scope This paper reports the result of experimental investigation on the failure mechanisms uniquely active in Pb-free solder joint in low-profile or micro-gap configuration. With an extremely small scale of the joint, in comparison to the diffusion distance of the constituents, these joints can be easily converted into IMC phase by thermal exposure. This makes various concerned failure mechanisms such as electromigration and thermal fatigue, to be very different from the conventionally known, increasing complexity of correctly assessing its reliability. For past few years we have investigated the mechanism of IMC growth and EM failure in low-profile solder joint and found the unique kinetic interplay between the diffusion and electromigration rate. Also discovered is the fact that IMC growth rate is not govern by a single kinetic mechanism but involves multiple diffusion/reaction stages. Major findings along with suggestion on the possible mechanisms will be presented in this paper.
Proceedings Inclusion? Definite: At-meeting proceedings

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A Model Study of Microstructure Evolution and Bi Diffusion in Sn-Bi Low Temperature Soldering Systems
Corrosion Behavior of Electroplated and Electroless Plating Ni/Pd/Au Surface Finish on Automobile Printed Circuit Board
Effect of Reducing Agent on the Joint Strength of Sintered-joint with Cu Paste
Effect of Thermal Annealing on Structural Integrity of Cu-filled-through Si Via (TSV)
Heated Mechanical Cycling as a Substitute for Thermal Cycling - A Preliminary Investigation for a New Failure Analysis Technique
IMC Evolution as a Function of Grain Orientation under High Current Density in Sn-based Solder Joints
Instability Detection in Press-fit Connector Pin Interconnects after Thermo-mechanical Cycling
Interfacial Reactions in Co/Ag-Cu, Ni/Ag-Cu, Co/Ag-Sb and Ni/Ag-Sb Couples
Micro Interconnect Mechanical Stability in Cryogenic Temperature Environment
Micro Interconnect Shear and Creep Performance under Current Stressing
Microstructure Evolution in Cu and Ag Coated Cu Particle Sintering for Power Module Interconnection
Predicting Electromigration-mediated Damage in Interconnects Using Phase-Field Models
Stretchable Joint with Ag-PDMS for Wearable Electronics
Understanding Reliability Failure Mechanisms in Pb Free Solder Joint with Micro-gap Configuration

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