|About this Abstract
||Materials Science & Technology 2019
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Understanding Reliability Failure Mechanisms in Pb Free Solder Joint with Micro-gap Configuration
||Choong-un Kim, Yi-Ram Kim, Hossein Madanipour
|On-Site Speaker (Planned)
This paper reports the result of experimental investigation on the failure mechanisms uniquely active in Pb-free solder joint in low-profile or micro-gap configuration. With an extremely small scale of the joint, in comparison to the diffusion distance of the constituents, these joints can be easily converted into IMC phase by thermal exposure. This makes various concerned failure mechanisms such as electromigration and thermal fatigue, to be very different from the conventionally known, increasing complexity of correctly assessing its reliability. For past few years we have investigated the mechanism of IMC growth and EM failure in low-profile solder joint and found the unique kinetic interplay between the diffusion and electromigration rate. Also discovered is the fact that IMC growth rate is not govern by a single kinetic mechanism but involves multiple diffusion/reaction stages. Major findings along with suggestion on the possible mechanisms will be presented in this paper.
||Definite: At-meeting proceedings