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Meeting 2018 TMS Annual Meeting & Exhibition
Symposium Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Presentation Title Study of the Solid-State Diffusion of Bi in Sn – The Effects of β-Sn Grain Orientation
Author(s) Andre Delhaise, Zhangqi Chen, Doug Perovic
On-Site Speaker (Planned) Andre Delhaise
Abstract Scope Bismuth (Bi) is one of the more extensively studied alloying elements being considered for alloying lead-free solder alloys to improve microstructure, properties, and reliability. It has been established that Bi preserves the strength of the alloy after aging. Examination of microstructure reveals that strengthening occurs with homogenization of Bi in the tin (Sn) matrix via solid-state diffusion. In this study, the effects of changes in Sn grain orientation on the diffusivity of Bi were analyzed. Sn was solidified slowly to produce coarse grains typical of grain morphologies in solder joints. Bi was subsequently sputtered onto the Sn, and samples underwent annealing at either 125oC or 100oC. Using compositional data collected from Electron Probe Microanalysis (EPMA), diffusivities were extracted for several orientations. Results show that the orientation of Sn has an influence on the diffusivity of Bi in Sn, with orientations closer to <100> yielding slightly higher diffusivities than those closer to <001>.
Proceedings Inclusion? Planned: Supplemental Proceedings volume


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A Study of Microstructure, Electronic Flame-off Characteristics and Electrical Properties of Au-coated Al-Zn Wires
Advances in Copper Electroplating for IC Substrate Packaging Applications
Altering the Mechanical Properties of Pb-free Solder Alloys by Alloying with Bi and Sb
Bonding Property of Silver Sintered Joint between SiC Device and DBC Substrates for EV Power Module
Characterization of Electromigration Damage in Sn-Cu Solder Joints Using Electron Backscatter Diffraction and 3D X-ray Microtomography
Characterization of X-ray Impact on Memory Retention Time for External In-package DRAM
Copper-to-copper Direct Bonding on Highly (111) Oriented Nano-twinned Copper in N2 Ambient
Corrosion Resistance of Surface Finishes for High Reliability Devices
Cu-to-Cu Direct Bonding by <111>-oriented Nanotwinned Copper Films with Chemical-mechanical Polishing
Damage Mechanisms in TSVs and Back-end Structures due to Thermal Cycling and Electromigration
Edge Effect and Phase Formation in Cu-Sn-Ni Micro Joints during Solid-state Aging
Effect of Copper Wire Diameter on the Variation in Shear Mode and Shear Strength
Effect of Orientation on the Bondability of the Sputtered Nano-twinned Copper
Effect of Sn Grain Orientation on Thermomigration in Sn2.3Ag Microbumps
Effect of Tin Orientation on Electromigration Failure of 20-um Microbumps
Effect of Twin Grains on the Void Formation in Copper Filled through Silicon via under Thermal Process
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Effects of Zn Addition on Cu-Sn Microjoints for Chip-stacking Applications
Electromigration Behavior in SABI333 Solder Joints
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Electroplated (111)-oriented Au Films in Au-Au Direct Bonding
Failure and Material Analysis Challenges in 3D Microelectronic Packages
Growth of Intermetallic Compound in Co/Sn3.5Ag/Co and Co/Sn3.5Ag/Cu Structure under Thermomigration
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High Temperature Mechanical Properties of Zn-based High Temperature Lead-free Solders
IMCs Growth Mechanism in Tricrystal Sn3.0Ag0.5Cu Solder Joints under Current Stressing
In-situ high-voltage TEM Observations of Polymorphic Phase Transformations in Cu6Sn5 Solder Joints
In Situ Studies of Whisker Nucleation Induced by Thermal Strain
In Situ X-ray Microtomography of Thermal and Power Cycling of Silver-based Thermal Interface Materials
Insights into the Heterogeneous Nucleation of βSn in Solder Joints
Interfacial Reaction of 68In32Bi and 33In67Bi Low Melting Alloy on Cu Substrate
Investigation of Processes Leading to Whisker Growth in Tin Thin Films with Advanced Multi-physics Simulations
K-1: Flexible Electrodes Based on the Carbon/Polymer Composite for Wearable Devices
K-2: Lead-free Nano-Solder Pastes for the Soldering of Cu-Cu Thin Wires
K-3: Mechanical Properties and IMC Morphology of Sn-58Bi Solder Including Sn-decorated MWCNTs
K-4: Theoretical and Experimental Study of Intermetallic Compound Grown by Electromigration, Thermomigration and Chemical Diffusion for Sn-0.7Cu Solders
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Pressureless Ag Sintering Process for IPM Modules
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Resistance Changes of Pd-coated Cu and Ag Bonding Wires in High Temperature Storage
Role of Bi in Microstructural Evolution of Sn-Cu-Ni and Sn-Ag-Cu Solders and their Mechanical Performance
Role of Surface Layer on Whisker Mitigation in Tin Doped with Indium
Sintered Silver-Indium Bonding Materials for High Temperature Applications
Study of Mechanical Properties in Aluminum Wedge-wedge Bonding
Study of the Solid-State Diffusion of Bi in Sn – The Effects of β-Sn Grain Orientation
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The Microstructure and Hot Rolling Deformation Mechanism of AuSn Eutectic Alloy
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The Role of Inhomogeneous Properties on Tin Solder Electromigration Performance
The Wetting and IMC Growth Behaviors between Zn-25Sn-xCu-yTi High Temperature Pb-free Solder Alloys and Cu
Thermal Cycling Reliability of Solder and NiSn Solid‒liquid Interdiffusion Joints with Thermal Coefficient Mismatch: Influence of Mechanical Properties of Joint Materials
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Zero Pressure Ag Sinter Joining for Low Temperature Interconnection

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