|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Sn-Ag-Cu Nanosolders: Reliability of the Solder Joints
||Ali Roshanghias, Andriy Yakymovych, Golta Khatibi, Herbert Ipser
|On-Site Speaker (Planned)
Albeit considerable research has been dedicated to the synthesis and characterization of lead-free nano particle solder alloys, still little has been reported on the reliability of the respective joints. In fact, the merit of nanoparticle solders with depressed melting temperature close to the Sn-Pb eutectic temperature has always been challenged when it compares to conventional solder joints, in terms of inferior wettability, due to the nano metric oxide shell, as well as compatibility with common fluxing agents. Correspondingly, in the current study, Sn-Ag-Cu nanoparticles alloys were combined with different ﬂuxing agents to produce prototype nanosolder pastes. The reliability of the solder joints was successively investigated by means of different techniques such as shear tests and electron microscopy. As a result, the optimized condition for employing nanoparticles as a competitive nanosolder paste and for a corresponding efficient reflow procedure has been proposed.
||Planned: A print-only volume