Jen-Jui Yu is a Ph. D candidate in the department of materials science and engineering, National Taiwan University, Taiwan and expected graduated on June, 2016. Now, he is a visiting researcher in department of materials science and engineering, UCLA to deploy his 7 years’ experience in microelectronic packaging and materials science especially in intermetallic compounds and metals.
His research mainly focus on the up-and-coming issues in 3D IC integration technology including interfacial reaction in microbumps, microbump modification and micromechanical behavior of microbumps. Multiple characterization techniques including scanning electron microscopy, transmission electron microscopy, electron back-scattered diffraction, synchrotron X-ray diffraction and nanoindentation are involved to investigate coupled effect of intermetallic morphology, crystal structure/orientation, phase and composition influence on the micromechanical behavior.
He also interested in development of advanced packaging architecture, nanomaterial mechanical behaviors and theories of dislocation, especially in intermetallic compounds.