|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XV
||Creep-induced Voiding in Sn phase of Pb-free Solder Joint
||Choong-Un Kim, Minyoung Kim
|On-Site Speaker (Planned)
Growing demand for electronic devices with small form factor results in the solder joints used in the those devices to take excessively small physical dimension such as in the case of the solder joint made of Cu bump. The metallurgical behaviors of such joints may seem similar to those of more conventional joints; however, there is a possibility that they show significantly different behaviors because of unusual geometrical constraints. One such mechanism found in our study is the voiding in Sn phase, which is a rare event in conventional joints. It is found that such voiding is driven by creep process that releases the tensile stress induced by the joint volume change associated with the solidification as well as the IMC phase formation. This paper presents evidences for the creep induced voiding mechanism along with discussion on the role of Sn surface energy affecting the location and shape of voids.
||Planned: A print-only volume