|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Ultrasonic Powder Consolidation of Sn/In Nanoparticles and Their Application for Low Temperature Cu-Cu Soldering
||Yang Shu, Somayeh Gheybi Hashemabad, Teiichi Ando, Zhiyong Gu
|On-Site Speaker (Planned)
Low temperature soldering is required for many electronics assembly processes, such as flexible electronics and thermal interface materials. Nanosolder materials have been proposed for low temperature soldering due to the melting temperature depression. Ultrasonic Power Consolidation (UPC), a new additive manufacturing technique which can metallurgically consolidate powders by ultrasonic vibration at low temperatures, enables to consolidate nanosolder powders for easier handling and prevention of surface oxidation. In this work, we consolidated Sn/In nanosolder particles from our previous research into nanosolder films. The quality of the consolidated samples was examined by observing the cross section with SEM. The Sn/In nanosolder films were used to join copper surfaces. The formation and growth of intermetallic compounds were studied using SEM and EDAX. Pulling tests were conducted to investigate the mechanical property of the solder joint. Results indicate that the Sn/In nanosolder film is a promising new approach for low temperature soldering applications.
||Planned: A print-only volume