|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Interface-driven Phenomena in Solids: Thermodynamics, Kinetics and Chemistry
||The Influence of Temperature in the Formation of Highly Nanotwinned Cu Alloys: Varying the Twin Thickness
||Leonardo Velasco, Andrea Mari Hodge
|On-Site Speaker (Planned)
Cu alloys of different compositions (Cu-6wt.%Al, Cu-4wt.%Al, Cu-2wt.%Al, and Cu-10wt%Ni) were sputtered at different deposition temperatures. The stacking fault energy (SFE) of the Cu alloys vary from 6 mJ/m2 to 74 mJ/m2. The deposition temperature was varied by heating and cooling the substrate, and using interrupted sputtering. The films had thicknesses > 15 μm, and the microstructures obtained were fully twinned. Theoretical predictions highlight the importance of sputtering deposition rate and the SFE. However, the temperature during processing alters the kinetics of the nucleated twin boundaries (twin boundary mobility), and leads to changes in the resulting microstructure, specifically the twin thickness. In this study transmission electron microscopy (TEM) was used to characterize the microstructures of the different alloys, and correlate the changes in twin thickness and twin boundary mobility with the increase in deposition temperature.
||Planned: A print-only volume