|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVII
||Ga-doping Effect upon Sn-0.7Cu/Cu Interfacial Reactions and the Isothermal Section of Sn-Cu-Ga Ternary System
||Chih-han Yang, Yu-chen Liu, Yi-kai Kuo, Shih-kang Lin
|On-Site Speaker (Planned)
In recent years, Sn-based Pb-free solders have been widely used for low-temperature soldering in three-dimensional integrated circuit (3D IC). However, voids and brittle intermetallic compounds form at interfaces due to the difference in diffusion rates of Sn and Cu. In our previous work, minor addition of Ga has been found to effectively mitigate the soldering reactions between Sn-58Bi solders and Cu substrates. In this study, the reactions between Sn-0.7Cu-xGa (x = 1~3) solders and Cu substrates at 200 oC for various lengths of time up to 1000 h were investigated using electron probe mi-cro-analyzer (EPMA) and CALPHAD thermodynamic modeling. Meanwhile, we conducted the Cu-Ga-Sn phase equilibria at 200, 300, and 360 ░C to elaborate the phase transformation in the Sn-0.7Cu-xGa/Cu couples. It is found that the reaction phase formation is strongly influenced by Ga concentrations.
||Planned: Supplemental Proceedings volume