About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Advances in Powder and Ceramic Materials Science
|
Presentation Title |
Ceramic Additive Manufacturing: Applications in High-Temperature Electronics |
Author(s) |
Bhargavi Mummareddy, Pedro Cortes, Bharat Yelamanchi |
On-Site Speaker (Planned) |
Bharat Yelamanchi |
Abstract Scope |
Ceramics have garnered special interest in different industries for their exclusive properties like high mechanical strength, resistance to high temperature, and corrosion. Especially in the field of electronics, and power distribution; ceramic-based components play an indispensable role. However, for the difficulties in the process-ability of intricate geometries, new manufacturing techniques are often researched. Additive Manufacturing (AM) stands out as an exemplary method for this purpose in terms of low material wastage and easy printability. In this work, diverse ceramics materials were printed using different AM technologies such as Digital Light Processing (DLP), and NanoParticle Jetting (NPJ) for producing structures to be used as circuit carriers, sensors, and heat sinks. Additionally, conductive metal-oxides such as silver, tungsten, molybdenum, and copper were printed on the ceramic substrates to suit high-temperature applications. The mechanical and thermal properties of the printed ceramic structures were also evaluated to characterize their processing-performance relationship. |
Proceedings Inclusion? |
Planned: |
Keywords |
High-Temperature Materials, Additive Manufacturing, Electronic Materials |