|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Pan American Materials Congress: Nanocrystalline and Ultra-fine Grain Materials and Bulk Metallic Glasses
||PAN-59: Microstructure and Properties of Equal Channel Angular Extruded and Recrystallized OFHC Copper
||Abhinav Srivastava, Jason Springs, Zach Levin, Robert Barber, Karl Hartwig
|On-Site Speaker (Planned)
Oxygen free high conductivity copper (OFHC) is the best conductor material for non-superconducting high-field electromagnetic applications because of its low electrical resistivity. As-cast OFHC Cu has large grains which impart low strength and unwanted texture to the bulk material. The present work focuses on equal channel angular extrusion (ECAE) processing of OFHC Cu bars with one-inch square cross sections via different routes to obtain ultra-fine grains to maximize strength. Selected samples were also rolled after ECAE processing. The objective of this study is to provide information about strength, electrical resistivity, grain size, texture, and recrystallization behavior of heavily worked copper. Cu bars were annealed at 350°C prior to performing multiple extrusions at room temperature with strain intensity of 1.16 per pass. Processed bars were subsequently recrystallized. Microstructure and strength results are correlated with processing history. This study aims to provide better conducting materials information for high field magnet builders.
||Planned: Stand-alone book in which only your symposium’s papers would appear (indicate title in comments section below)