|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVI
||Electromigration Effects upon Interfacial Reactions in Electronic Solder Joints of Different Bump Heights and Different Electric Current Densities
||Jing-wei Chen, Sinn-wen Chen, Yi-cheng Lin, Tao-chih Chang
|On-Site Speaker (Planned)
Passage of electric current causes electromigration and joule heating at the electronic solder joints. Both effects elevate atomic fluxes and cause interfacial reactions. Interfacial reactions in the Sn-Ag/Ni/Sn-Ag, Sn-Ag/Cu/Sn-Ag and Ni/Sn-Ag/Cu samples were examined at 125, 150 and 200°C with and without passage of electric currents. The reaction couples were of different bump heights. Electric current of different densities and directions were applied to the samples under specific reaction temperatures. With or without current stressing, one reaction layer, Ni<SUB>3</SUB>Sn<SUB>4</SUB>, was formed at Ni/Sn-Ag interface, and two layers, Cu<SUB>3</SUB>Sn and Cu<SUB>6</SUB>Sn<SUB>5</SUB>, were formed at Cu/Sn-Ag interface. The thickness and structure of reaction layers varied with different current density and bump height. A one-dimensional mass transfer model was developed to describe the growth of the reaction phase layer. The effects of diffusion and electromigration upon the layer growth are compared and discussed. The electromigration effect is more significant at lower temperatures.
||Planned: Supplemental Proceedings volume