|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Identifying Alternative Formulations for Transient Liquid Phase Bonding
||John Holaday, Carol Handwerker
|On-Site Speaker (Planned)
Transient liquid phase bonding technologies (TLPB) are being considered as alternative thermal interface materials and processes for die and heat-rail attach in power electronics. TLPB differs from other bonding methods involving liquid phases, such as liquid phase sintering or soldering, in that a low-melting temperature phase (LTP) melts and reacts completely with a high-melting temperature phase (HTP) to form intermetallic compounds (IMC) with higher melting points than the original LTP. We will present our framework for identifying processing and operational constraints for Sn-based TLPB systems based on existing thermodynamic databases as well as experimental verification.
||Planned: A print-only volume