|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||In Situ FIB/SEM Tensile Testing of Tin (Sn) Whiskers
||Renuka Vallabhaneni, Ehsan Izadi, Carl Mayer, Sudhanshu S Singh, C. Shashank Kaira, Jagannathan Rajagopalan,
|On-Site Speaker (Planned)
Tin and tin-alloyed electroplated films are known to be susceptible to whisker growth under a range of conditions. Extensive studies have been performed on the mechanisms of whisker growth but not much has been reported on the mechanical properties of the tin whiskers themselves. We report on the tensile strength of tin whiskers which were obtained by indentation and furnace aging of electroplated tin films on copper discs. Tensile tests were carried out by lifting out of whiskers using FIB and placing them on MEMS tensile testing stage inside FIB/SEM. The effect of variation of gauge length and oxide thickness on the strength of whiskers will be presented. The deformation mechanisms of whiskers were studied using TEM, and will be discussed.
||Planned: A print-only volume