|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Alloys and Compounds for Thermoelectric and Solar Cell Applications IV
||Interfacial Reactions of PbTe and Pb0.6Sn0.4Te Thermoelectric Materials with Ag and Cu Foils Using Rapid Hot-Pressing Method and SLID Technique
||Cheng-Chieh Li, F. Drymiotis, L. L. Liao, H. T. Hung, C. K. Liu, Chin C. Lee, C. Robert Kao, G. Jeffrey Snyder
|On-Site Speaker (Planned)
The focus of this study is to establish the foundation for building PbTe-based thermoelectric modules for power generating that are capable of long-term operations at high temperature. In this study, two easily obtained materials, Cu and Ag foils are isothermally hot-pressed to PbTe-based thermoelectric materials by the rapid hot-pressing method. PbTe/Ag are then connected with Alumina substrate by Ag/In/Ag system. Scanning electron microscopy and X-ray diffraction analysis are employed to identify intermetallic compounds, chemical reactions, and microstructure evolution after assembly and subsequent isothermal annealing at 400°C and 550°C. We identified Ag was a promising and stable bonding material for PbTe modules operating at THot ≤ 400°C. However, Cu diffuses faster than Ag in PbTe. It would be necessary to insert a diffusion barrier layer for Cu electrode to prevent the Cu diffusion into PbTe. In addition, both Cu and Ag are quickly consumed in reaction with Pb0.6Sn0.4Te.
||Planned: A print-only volume