|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XV
||Interfacial Reactions in the Ni/Ag-Sb and Ni/Ag-Ge Couples
||Sinn-wen Chen, Ling-chieh Chen, Jen-chieh Wang, Po-han Lin
|On-Site Speaker (Planned)
Nickel is commonly used as a barrier layer. The interfacial reactions are examined between Ni and the eutectic Ag-Sb and Ag-Ge alloys which are candidates as joining materials. One phase with a composition of Ni-36.2at.%Ge-0.1at.%Ag is formed adjacent to the Ni substrate in the Ni/Ag-24.5at%Ge couple reacted at 400oC. It is the Ni5Ge3¬ phase with only 0.1at% solubility of Ag. A region of nearly pure Ag is formed between this reaction phase and the eutectic Ag-24.5at%Ge, and is a result of Ag left over caused by the reactions between Ge and Ni. Two reaction phases are formed in the Ni/Ag-41.0at%Sb couple reacted at 350oC. Their compositions are Ni-50.0at%Sb- 0.1at%Ag and Ni-66.4at%Sb-0.1at%Ag, and are NiSb and NiSb2, respectively. The region of the Ag-Sb eutectic adjacent to the reaction phases becomes Ag-rich and is resulted from the consumption of Sb in the interfacial reactions, similar to that observed in the Ni/Ag-24.5at%Ge couples.
||Planned: A print-only volume