|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||In Situ Mechanical Testing of Micro-Scale Solder Joints
||Leila Ladani, Soud Choudhury
|On-Site Speaker (Planned)
Current trend in miniaturization of electronic devices is the driving factor for size reduction in joints and interconnects. The electronic industry is expecting to use joints as small as 10-20 microns in next generations of electronic devices. Mechanical behavior of these joints will significantly be different from traditional solder joints due to effects such as microstructural constraints and anisotropy caused by reduction in number of grains. Mechanical experiments at this scale are very challenging. This manuscript focuses on in situ mechanical testing of joints as small as 20 microns. The test apparatus and test method are explained in details. The strain measurement technique which includes Digital Image Correlation is elaborated. An experiment is conducted on joints fabricated using Sn-3.5Ag solder ribbon and Cu substrate with different IMC and joint thicknesses and the size effects are explored.
||Planned: A print-only volume