About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Aluminum Alloys, Characterization and Processing
|
Presentation Title |
Microstructural Changes on the Al−Cu−Si Ternary Eutectic Alloy with Different Cooling Rates |
Author(s) |
Seunghwan Oh, Youngcheol Lee |
On-Site Speaker (Planned) |
Seunghwan Oh |
Abstract Scope |
In order to understand its solidification behavior and microstructural evolution of Al−Cu−Si ternary eutectic alloy, microstructural changes of a ternary Al−Cu−Si eutectic alloy with different cooling rates were investigated. Thermodynamic analysis of the alloy system showed that the equilibrium solidification of the ternary eutectic alloy followed three stages− precipitation of primary Si phase, evolution of binary eutectic Si+Al2Cu and the formation of ternary eutectic Al+Al2Cu+Si. In order to investigate the microstructure of the alloy with rapid cooling, the mold preheated temperature was controlled. With higher cooling rates, a bimodal microstructure, which is composed of eutectics with different length scale, were developed. However, it is practically difficult to implement rapid cooling in the foundry industry. Therefore, a study on the microstructural modification of Al−Cu−Si ternary eutectic alloy under the normal casting conditions is conducted and the results are investigated in this study. |
Proceedings Inclusion? |
Planned: Light Metals |