The growth of diamond films is a complex, intensive process involving specific substrates or seed layers. Due to these issues, the ability to attach and pattern polycrystalline diamond to various substrates for use as a seed layer is of great interest. Diamond films can allow one to take advantage of diamond’s high hardness for mechanical applications and high thermal conductivity for use as a heat sink in electronic applications. A colloidal protocol was developed, based on established conjugation techniques, to covalently attach sonicated nanodiamond particles to a variety of substrates. Using the developed protocol, nanodiamond was covalently bound to graphene and silicon substrates, creating polycrystalline layers of various thicknesses. Control of the film thickness was looked into by modifications of diamond size, monodispersity, and the amount used in the formulated protocol. Characterization was performed on the diamond – particle bonding as well the diamond particles that were created from sonication.