|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Measurement of Electrical Resistance of CNTs
||Leila Ladani, Zakia Ahmed
|On-Site Speaker (Planned)
The evolving microelectronics industry calls for the next generation of highly efficient and reliable interconnects. Carbon Nanotube (CNT) interconnects are being developed to improve electrical transport for microelectronics applications. CNTs have enhanced electrical and mechanical properties which allows for better performance and more compact design of microelectronics. A novel fabrication method is proposed that facilitates electrical testing and characterization of the CNT interconnects. CNT bundles are grown in a layer of insulating material that will electrically isolate the bundles to allow for current to pass solely through the bundles. This layer is sandwiched between two conductive layers of the same material such that an applied current on one conductive layer will pass through the CNT interconnects and be transported to the second conductive layer. This provides for a method to probe the electrical transport and characterize the CNT interconnects. We presents the fabrication process, theoretical evaluation and electrical measurement results.
||Planned: Supplemental Proceedings volume