About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
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Symposium
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Deformation-induced Microstructural Evolution during Solid Phase Processing: Experimental and Computational Studies
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Presentation Title |
Ultrafine-grained Bonding Interface of 316L Stainless Sheets Processed by Ultrasonic Spot Welding |
Author(s) |
Jheyu Lin, Hue-En Chu |
On-Site Speaker (Planned) |
Jheyu Lin |
Abstract Scope |
In this study, ultrasonic spot welding was utilized to investigate the feasibility of joining hard stainless steel sheets. From microstructural characterization using scanning electron microscopy (SEM) and electron backscattered diffraction (EBSD), it is found that after 0.5 s welding time, an ultrafine-grained microstructure with a grain size distribution less than 500 nm was produced at the bonding interface. Such microstructure could be attributed to dynamic recrystallization, which originated from frictional heat and severe plastic deformation during USW, accompanied by deformation-induced martensite transformation near the bonding interface. As welding time increased, the bonding interface evolved to an even distribution of larger recrystallized grains with sufficient strength. In the future, we will further characterize such nano-grained microstructure using transmission electron microscopy and transmission Kikuchi diffraction techniques |
Proceedings Inclusion? |
Planned: |
Keywords |
Joining, Iron and Steel, Characterization |