| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Microstructure and Orientation Evolution Study on Sn-Ag-Cu Solder Joints as a Function of Position in Ball Grid Arrays Using Orientation Image Microscopy |
| Author(s) |
Tae-Kyu Lee, Kuo-Chuan Liu, Bite Zhou, Thomas R. Bieler |
| On-Site Speaker (Planned) |
Tae-Kyu Lee |
| Abstract Scope |
The microstructure evolution of Sn-Ag-Cu solder alloy joints are observed during thermal cycling, focused on Sn grain orientation in ball grid array (BGA) packages with different die sizes. Thermally cycled BGA packages after various pre-conditions with 196 full array solder joints are used in this study. Each selected package is polished to view the solder joints from the top by using an Orientation Imaging Microscopy. The observations reveal different patterns of single and multi-grained Sn microstructure distribution and Sn c-axis orientation for each solder joint as a function of position in the package depending on their pre-condition and thermal cycle history. The overall percentage of the single grain oriented solder joints is reduced after thermal cycling with a faster rate after 150oC aging condition compared to lower aging temperature. The difference of the distribution of individual grain orientations and evolution of those orientations during thermal cycling are discussed. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |