In this study, the liquid/solid interfacial reaction of the Sn solder with C194 substrate was investigated. The microstructures, compositional data were examined together to identify the phases present in each couple. The reaction temperatures were at 240, 255 and 270 ░C, and the reactions times were varied between 0.5 to 5 hours. According to experimental results, the massive spalling of the (Cu, Fe)6Sn5 phase was found at the interface in all reaction couples. In addition, with the extension of the reaction time, the ripening phenomena of the (Cu, Fe)6Sn5 phase became significant. The intermetallic compound (IMC) spalling length was increased with the increase of reaction times and was decreased with the increase of reaction temperatures. When the reaction couples were reacted at 270℃ for 1 h, the (Cu,Fe)3Sn phase was observed at the interface.
Keywords: interfacial reaction, Sn/C194 couple, Intermetallic compounds