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Meeting 2018 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVII
Presentation Title The Study of Interfacial Reactions between Sn and C194 Alloy
Author(s) Pei-Yu Chen, Chih-Hung Lin, Yee-Wen Yen
On-Site Speaker (Planned) Chih-Hung Lin
Abstract Scope In this study, the liquid/solid interfacial reaction of the Sn solder with C194 substrate was investigated. The microstructures, compositional data were examined together to identify the phases present in each couple. The reaction temperatures were at 240, 255 and 270 ░C, and the reactions times were varied between 0.5 to 5 hours. According to experimental results, the massive spalling of the (Cu, Fe)6Sn5 phase was found at the interface in all reaction couples. In addition, with the extension of the reaction time, the ripening phenomena of the (Cu, Fe)6Sn5 phase became significant. The intermetallic compound (IMC) spalling length was increased with the increase of reaction times and was decreased with the increase of reaction temperatures. When the reaction couples were reacted at 270℃ for 1 h, the (Cu,Fe)3Sn phase was observed at the interface. Keywords: interfacial reaction, Sn/C194 couple, Intermetallic compounds
Proceedings Inclusion? Planned: Supplemental Proceedings volume

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Electric Current-induced Slip/Twin Transition: An In Situ EBSD Study
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Interfacial Reaction Studies in SLID Bonding Processes Using Ga and In
Interfacial Reactions in the Au/Sn/Ni/Cu Multilayer Couples
Hide details for [<a href="/PM/PM.nsf/ApprovedAbstracts/7B7A9BA8C19DD3BE85258150001FB51F?OpenDocument">K-13: Interfacial ReactiK-13: Interfacial Reactions between Lead-free Solders and Cu-xZn Alloys
[Replication or Save Conflict]
K-14: Microstructure and Optical Properties of Cr1-xAlxN Films Synthesized by Reactive Magnetron Sputtering
K-15: The Electromigration Effect Revisited: An In Situ SEM and SR-based XRD Study
Liquidus Projection of Quaternary Ge-Sn-Co-Sb System and Thermoelectric Properties of Sn/Ge Doped Skutterudite CoSb3
Mechanical Properties of In-33.7Bi Alloy for Low Melting Temperature Solder
Microstructure Evolution due to Isothermal Reactive Diffusion between Solid Co and Liquid Sn
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Phase Equilibria of the Li-Si-C System for Advanced Anodes in Li-ion Batteries
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Sinter Joining and Wiring without Pressure Assist for GaN Power Device Interconnection
Solid-solution Cu-to-Cu Interconnection Fabricated with Sub-micron Ga-based Pastes
Structural Stability and Chemical Reactivity of Nanoscale Twinning Structure in Copper Nanowires
The Investigation of Electromigration Defects on Cu/Sn and Cu/Ag IMC due to Currents Stress and Temperature
The Role of Retained Structures in Phase Transition and Piezoelectric Properties of PMN-PT Single Crystals
The Study of Interfacial Reactions between Sn and C194 Alloy
Thermodynamic Stability Maps for the La0.6Sr0.4Co0.2Fe0.8O3▒δ–SO2–O2áSystem for Application in Solid Oxide Fuel Cells

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