|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVII
||Microstructure Evolution due to Isothermal Reactive Diffusion between Solid Co and Liquid Sn
||Minho O, Noritomo Odashima, Masanori Kajihara
|On-Site Speaker (Planned)
Cobalt possesses excellent wettability with Sn-base solders and dissolves into the molten solder more slowly than Cu and Ni. On the other hand, compound growth due to the solid-state reactive diffusion with Sn occurs much faster for Co than for Cu and Ni. However, reliable information on growth behavior of Co-Sn compounds during soldering is rather limited. To obtain such information, microstructure evolution owing to the reactive diffusion between solid Co and liquid Sn was experimentally observed using solid-Co/liquid-Sn diffusion couples prepared by an isothermal bonding (IB) technique. In the IB technique, the solid and liquid metals are separately preheated at the same temperature as isothermal annealing and then annealed immediately isothermally. The annealing of the diffusion couple was conducted for various times in the temperature range between 563 K and 603 K. The rate-controlling process of the reactive diffusion was discussed on the basis of the observation.
||Planned: Supplemental Proceedings volume