About this Abstract |
Meeting |
2022 TMS Annual Meeting & Exhibition
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Symposium
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Mechanical Response of Materials Investigated Through Novel In-Situ Experiments and Modeling
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Presentation Title |
X-ray Microbeam Characterization of Electromigration Process in Al(0.25wt% Cu) Interconnect |
Author(s) |
Ping-Chuan Wang, Kieran Cavanagh |
On-Site Speaker (Planned) |
Ping-Chuan Wang |
Abstract Scope |
Various x-ray microbeam techniques have been developed around 20 years ago to provide fundamental understanding of electromigration (EM) mechanisms in Al- and Cu-based interconnects. For solid solution based interconnects, such as Al with Cu impurity added for reliability purpose, interaction between solvent and solute during EM process significantly complicates the resulting stress/strain distribution. This was directly measured for the first time using x-ray microdiffraction by Cargill’s group at Lehigh University in 2003. Around the same time, the x-ray micro-topography technique was developed, providing high strain sensitivity to allow finer observation of local stress evolution during early stages of EM process. In this presentation, we will revisit the micro-topography technique in achieving real-time simultaneous measurement of EM-induced stress and Cu distribution in Al(Cu) interconnects. New insight yielded from recent data analyses will be discussed, along with numerical modeling, to further explore the role of Cu solute in retarding Al electromigration. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Characterization, Mechanical Properties |