|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Effects of Zn Addition on Cu-Sn Microjoints for Chip-stacking Applications
||Yi-Wun Wang, Ting-Li Yang, C.R. Kao
|On-Site Speaker (Planned)
Intermetallic compounds can occupy a very large portion of volume in microjoints after reflow or thermal compression bonding process. This study provides fundamental data that are critical to the design of microjoints for chip-stacking applications. Sandwich structures of Cu/Sn/Cu and Cu/SnxZn/Cu are prepared by thermal compression bonding. The thickness of Sn and SnxZn layer is controlled at 10μm. High temperature storage tests are conducted at 150 and 180<SUP>o</SUP>C for different reaction time. Zn addition inhibit the Cu<SUB>3</SUB>Sn and microvoids growth significantly. The time-to-impingement of intermetallic compounds is extended by Zn addition. Moreover, the results also imply that both solder volume effect and Zn concentration effect should be taken into consideration carefully, particularly for microjoints applications.
||Planned: Supplemental Proceedings volume