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Meeting 2018 TMS Annual Meeting & Exhibition
Symposium Phase Transformation Across Multiscale Material Interfaces
Presentation Title Transient-liquid-phase-bonding and Mechanical Properties of Ni-based-superalloy-H230 for Heat Exchangers in Supercritical CO2 Power Cycles
Author(s) Monica Kapoor, Omer Dogan, Kyle Rozman, Jeffrey Hawk
On-Site Speaker (Planned) Monica Kapoor
Abstract Scope Transient-liquid-phase-bonding (TLPB) of Ni-based-superalloy-H230 is investigated for potential utilization in microchannel heat exchangers (HX). These HX operate at 700C-800C and 20-30 MPa in sCO2 power cycles. The two surfaces to be joined by TLPB are coated with a low-melting interlayer, NiP in this case. The interlayer melts at the bonding temperatures thereby enhancing diffusion processes to aid the formation of a bond across the two surfaces. Ideally, this bond should form a homogeneous microstructure without any second phases in order to have uniform mechanical properties across the structure. The H230 TLP-bonded stacks fractured through the joint region on tensile testing and the plastic strain was constrained in the vicinity of the fracture region. These stacks were creep tested at 800C and their performance compared to that of bulk H230. Scanning and transmission electron microscopy of creep-tested samples to understand failure mechanisms in the stacks has been performed.
Proceedings Inclusion? Planned: Supplemental Proceedings volume


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Structure and Mechanical Response of Highly Defective Grain Boundaries
Structure and Properties of BCC Mg Synthesized Using Interface Strain Engineering
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Transient-liquid-phase-bonding and Mechanical Properties of Ni-based-superalloy-H230 for Heat Exchangers in Supercritical CO2 Power Cycles

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